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Which semiconductor technology is used to manufacture modern Dynamic RAM (DRAM) cell capacitors?

ABipolar Junction Transistors (BJT)
BMetal-Oxide-Semiconductor (MOS)
CVacuum Tubes
DRelays

Explanation

DRAM cells consist of a single MOSFET transistor and a capacitor. Because capacitors leak charge over time, DRAM requires periodic electronic refreshing to maintain stored data.

Exam Relevance
  • Topic: Computer Hardware & Architecture
  • Subtopic: RAM Technologies
Submitted by: mcqstutor Team More Computer MCQs →

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