Which semiconductor technology is used to manufacture modern Dynamic RAM (DRAM) cell capacitors?
ABipolar Junction Transistors (BJT)
BMetal-Oxide-Semiconductor (MOS)
CVacuum Tubes
DRelays
Explanation
DRAM cells consist of a single MOSFET transistor and a capacitor. Because capacitors leak charge over time, DRAM requires periodic electronic refreshing to maintain stored data.
Exam Relevance
- Topic: Computer Hardware & Architecture
- Subtopic: RAM Technologies

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